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IBM to introduce vertical stacking in next line of supercomputers
Manish Kanaujia | Apr 13 2007
samsung chip
In order to introduce next-generation supercomputers IBM has announced to introduce vertical stacking technology in their upcoming line of computers. This cool technology lays the chip vertically to eliminate side by side assembling of chip. It...
Tags: IBM, Vertical stacking, Tungsten, Silicon, Technology, Related : Consumer Electronic Gadgets, free cell phone number search

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