The University of California, San Diego (UCSD), in collaboration with Defense Advanced Research Projects Agency (DARPA) has designed an advanced silicon chip dubbed as UCSD DARPA Smart Q-Band 4×4 Array Transmitter that can be used for multiple purposes such as high speed data transfer, direct TV broadcast and satellite system.
It is the most complex silicon phased array chip in the world promising productive results in military sensor and communication systems.
The small sized chip can transfer hundreds of gigabytes data very speedily without depending upon cable connection or adhering to the alignment requirements of wireless optical data transfer.
The UCSD DARPA Smart Q-Band 4×4 Array Transmitter comes with a single transmitter integrating 16 channels into a 3.2/2.6 mm² chip. Thus, input signal is separated on-chip into 16 different routs with equivalent amplitude and phase using an innovative design.
The size of the chip is just 3.2 by 2.6 square millimeters. It has also CMOS digital circuits required for complete digital control of the phased array.
The Department of Defense is planning to use the latest chip in its satellite communication and radar systems.
The complex silicon chip was designed by two electrical engineers, Kwang-Jin Koh and Jason May of UCSD. It was first displayed at DARPA Team Meeting held in Chicago in the month of August.
Via: Science Daily
