A leader in advanced semiconductor technology, Samsung Electronics Co., Ltd. has launched an improved digital TV receiver chip, named the S5H1411 for North American market. The SCH 1411 increases 30 percent higher reception success rate than the company’s previous digital TV receiver chip, S5H1409.
The chip enables digital TVs to receive both vestigial sideband (VSB) broadcasts and quadrature amplitude modulation (QAM) cable signals. The S5H1411 offers a higher reception success rate in multi-path environments where signal interference is high like densely populated urban areas. Additionally, the S5H1411 operates on 20 percent less power than other competing devices. Samsung’s new S5H1411 digital TV receiver chip is available in the thin quad flat pack. Even the footprint n the print circuit board could be reduced by 40 percent. The devices can be used in digital broadcast set up boxes with terrestrial and cable reception as well as TV reception cards for PCs, USB Dongles and USB boxes.
Samsung is the first company in the world to adopt 65nm process technology to broadcast TV receiver chip circuitry. The new S5H1411 has following features:
1) Vestigial Sideband (VSB): It has Vestigial Sideband , which is the digital TV transmission standard for terrestrial broadcasts in the US, Korea and Canada. Its frequency band utilization is high, and the format maximizes the area coverage. Its Interference with analog signals can be minimized, while high-definition digital broadcasting is made easier.
2) Quadrature Amplitude Modulation (QAM): This modulation method for cable broadcast reception is classified into technologies ranging from 4-QAM to 256-QAM, depending on the volume of data being transmitted. The 64-QAM form transmits data at 26.97Mbps.
3) USB Dongle: This is a connector that plugs into the USB port of a computer to copy protect software.
4) Thin Quad Flat Pack (TQFP): This IC packaging comes with a thickness of either 1.0mm or 1.4mm. The leads extend straight out from all four sides of the package.
5) Fine-pitch Ball Grid Array (FBGA): This IC packaging has tiny solder balls on the bottom for conducting electrical signals from the integrated circuit to the print circuit board.
Image Credit: TKD & Electronics Specifier
Via: Phys Org
