Samsung Electronics has the plans to put a new fusion semiconductor dubbed Flex-OneNAND in production next month. The new 4GB semiconductor will let CE designers to exercise both types of NAND flash memory, the single level cell (SLC) and multi-level cell (MLC) NAND, in the same device for the very first time.
The announcement was made at the Mobile Solution Forum in Taipei. The single silicon chip features novel Samsung software to enhance flexibility in memory utilization. The quicker read-and-write potential of SLC NAND flash helps in processing the ‘code’ data used largely in device boot-up and data downloading.
Moreover, the Flex-OneNAND minimizes the area required for the memory on the print circuit board and perks up output by thinning transmission noise.
Via: physorg
