The 450 mm wafers could trounce the monopoly of IC and chip-equipment and force them to file for insolvency. Well, this could be a hypothetical situation as the wafers are quite gamble and can trounce themselves into bankruptcy. In an industry which is fueled by minute by minute competition to produce something new, one cannot actually predict how thongs might turn out. Samsung, which might get to take the major step in this regard, can give other companies a tough time many of which may not be able to afford to shift to the new wafer size. Nippon, Brooks and Asyst are some companies which are quietly working on the wafers.
Interestingly, Intel, Samsung and TSMC have reached an agreement to collaborate on the 450 mm wafers from 2012 as they feel it could help the industry to improve its return on investment. The issue being affordability, contradicting opinions indicate some believe the wafers would decrease the manufacturing costs where as the others indicate at an unpleasant situation from where there is no return. Smaller companies feel 300 mm wafers are enough to meet the demands of the future. The consumers can only wait and watch till the big names fight it out for the next successor to the IC/Chip industry.
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Via: EETimes
