DRAM chips have yet to find a niche for themselves in the market, but the fact hasn’t really played on the minds of the market players, and has perturbed them least. Samsung stands upright to back our claims, having announced the world’s highest density, 4Gb DDR3 chip, to deliver an industry leading high density DRAM chip, and keep the world thinking again.
Using just 50 nanometer process technology, the 4Gb DDR3 DRAM chip runs at 1.6Gbps and is highly efficient consuming 40% less power, gulping only 1.35 volts to operate, in contrast to 1.5 volts consumed by the other DRAM chips. The 4Gb can be used in servers, desktop PCs, workstations and notebooks, given that it can be produced in chips in 16GB RDIMM, 8GB UDIMM and SODIMM modules.
If Samsung goes on to use its dual-die package technology, as the hearsay has it, to package – then the 4Gb DDR3 chip could definitely deliver modules with up to 32GB of memory, giving a double boost to the chip capacity presently.
Comments
I am impressed with Samsung as a company. I own several of their products and of late (last 5 years) they are continually polishing and raising the bar on consumer products. Refinement seems to be a cornerstone of their corporate philosophy.
I agree with Timo said
You know what Samsung says about this wonderful technology that it can use its dual-die package technology to package two of the 4Gb 16GB modules on a package for 32GB of memory, doubling the capacity the previous highest density chip was capable of.That’s really a wonderful technology.
Well we do need high capacity memories in small area. This will help a lot