Samsung develops an improved 4GB DDR2 DIMM
Posted By: Naveen Kumar | Apr 24 2007
Some good news for the PC makers has arrived as Samsung has announced the development of first 4GB DDR2 DIMM using 'through silicon via' (TSV) technology that augments the memory performance and power efficiency. The WSP (wafer-level-processed stacked package) comprises four 512 MB DDR2 chips thereby offering 2GB of high-density memory. Anyhow, they haven't opened their mouth on the pricing and availability of the new product.
4gb ddr2 dimm 48
Via: PClaunches
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