New three dimensional integrated chip technology developed
In what could be seen as a major push to expand the computer chip capabilities, South Korean engineers at the National Nanofab Center have developed a 3D IC. This may overcome the limits posed by 2D CMOS, which is used in microprocessors, microcontrollers and other circuit related technologies. The new system overcomes difficulties and limitations that inefficient wire bonding techniques commonly posed by multi-chip packages. The new three dimensional integrated circuit system makes it possible to have a limitless number of vertical connections linking chips. Now, manufacturing process can take place at under 400C compared to earlier 850C. The technology is also cost effective and soon we may see commercial production taking place.
Via: mbtmag
