New 16-Chip 'Multi-Stack Package' technology by Samsung offers maximum density solution

To sustain the industry-wide demand for small form factors and high-densities, and to accommodate multimedia-intensive user applications, Samsung Electronics proclaimed a process, which will facilitate innovative fabrication of a 16-chip multi-chip package (MCP) of memory and provide the maximum density solution for the manufacture of consumer electronics, only one year after development of its first 10-chip MCP in 2005.

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With the introduction of wafer-thinning technology, the new 16-chip process eradicates 24 over 25 (24/25) of the thickness of fabricated-wafer to trim down the overall thickness to 30-micrometers, which is 65 percent, in comparison to the 10-chip MCP wafer (45). The new technology can facilitate up to a 16 gigabyte (GB) MCP solution, while applied to 8Gb NAND flash chips.

As well as, to avert the memory chips from breaking into pieces, Samsung expanded a new laser-cutting technology to cut the wafer into individual chips, as a part of its MCP advance.

The new technology, certainly, will provide a top density solution to match the additional multimedia features and design thinner consumer electronics, which is the hot-demand of the manufacturers of mobile devices.

Via: aving.net