In order to introduce next-generation supercomputers IBM has announced to introduce vertical stacking technology in their upcoming line of computers.
This cool technology lays the chip vertically to eliminate side by side assembling of chip. It reduces the distance data traveling time by 1,000 times and enables the chip to function faster and more efficiently.
The new format places the chips directly on the top one after another and ties them with tungsten filled pipes etched through silicon to consequently eliminate the need for wires and to increase the data traveling speed
This new technology will apparently function around 40-percent more efficiently than existing renditions but the availability of this new technology is still not yet confirmed.
Via: Engadget
