Yesterday, we were talking about the Celsia’s new cooling equipment that used steam for cooling the torrid hotspots of the computers. Now, researchers at the IBM’s Zurich Research Laboratory in Switzerland are saying that the computer processors could be cooled more efficiently just by improving the way dissimilar bits are glued together.
They have affixed a piece of metal called the heat sink to the chip that conducts the heat away. These heat sinks are cooled by fans. The very problem arises when the heat sink is attached to the chip. The process hinders the heat transfer process as it creates hotspots that prevent parts of the chip from cooling effectively.
The researchers used a pattern of micrometre-sized channels at the bottom surface of the heat sink to overcome this problem. These channels function as an irrigation system for the paste. These micro channels are expected to appear in chips in 2008.
Via: Newscientisttech
