The researchers at Clemson University have achieved a major breakthrough in process technology, which they claim would enable the development of high speed and cooler microprocessor for the semiconductor devices such as laptops, desktop computers and mobile handsets in the coming days.
The newly developed process technology will immensely reduce the heat generated by silicon chips or microprocessors so that data transfer ability of the semiconductor devices will be scaled up at a tremendous fast.
The Clemson researchers claimed that the low-heat microprocessor will also enable the future multi-core chips to get less physical cores due to the fact that the chips can be clocked higher and perform more works.
Rajendra Singh of Silicon Nanoelectronics at Clemson University elaborated,
In the future it will be possible to use a smaller number of microprocessors in a single chip since we’ve increased the speed of the individual microprocessors. At the same time, we’ve reduced power loss six-fold to a level never seen before. Heat loss and, therefore, lost power has been a major obstacle in the past.
However, the Clemson scientists have not provided further details about the process technology, materials used for the process equipment or manufacturing methods. It is just the preliminary report of their findings, published in Electronics Letters in October.
Via: Science Daily
