If you are looking for the best interface options for your PC, then look no further than this. It is simple one-on-one microprocessor technology that tells you that more pins and a better port means more data transfer and user interface with external components a lot better and a lot faster. Most CPU-sockets interfaces are based on the pin grid array architecture, in which short, stiff pins on the underside of the processor package mate with holes in the socket. Now you have the best CPU socket from Nehalem. LGA1366 socket for uni-CPU (Bloomfield) and dual-CPU 2008 Nehalems is not just 20 per cent bigger on each side than the LGA775 for the current Penryns. It contains nearly 600 extra pins for those QPI links, three 64-bit DDR3 memory channels and, obviously, a lot of power. It is also seemingly far more robust when it comes to keeping it tight to the mobo. While the front CPU socket insertion seems the same as right now, the back portion has a proper metal back plate which, via four screw holes, holds the CPU socket firmly without banding under, say, heavy fans. It really makes for better and faster data transfer.
The larger die will be cooled by a larger heat spreader on the larger package here as well. But there is no way you can use the current coolers with this and hence integration will not be easy without the replacement of both. Cooling is a real issue and frankly I do believe the technology needs to grow a lot more as it is really still dishing out plenty of noise which is pretty pathetic. Beyond that, this really is worth a change.
