We’ll keep aside the complex but intriguing technical details behind the innovative concept for the time being and know exactly what it can offer to all geeks out here reading this.



The 3-D flexible chip or better say film, developed by engineers at the University of Wisconsin-Madison, is just 200 nanometers thick and is stacked along with other similar films on plastic, or any flexible material such as glass, making a powerful 3-D flexible computer chip. The technique could also give way to the production of solar cells, smart cards, RFID tags or active-matrix flat panel displays.



What makes this semiconductor film special is the fact that it allows components to be placed on both of its sides, simply making it more powerful and enabling the creation of low-power, 3-D electronic devices.



Via: primidi